Thermal stress relaxation behavior in thin films under transient laser-pulse heating
- 15 April 1993
- journal article
- conference paper
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 73 (8) , 3749-3752
- https://doi.org/10.1063/1.352907
Abstract
Transient laser pulse has been used to generate nonsynchronous change of temperature rise and thermal expansion in thin films. The transient process of thermal expansion is recorded by a photoelectric high-speed acquisition system. By comparison of the calculated temperature rise and thermal expansion, thermal stress relaxation processes in Al films of 20–50 μm thickness is obtained. This result shows that, for transient heating, thermal stress exists even in the case of uniform temperature distribution and free expansion. And also there is a transient high stress in thin films under high-speed heating.This publication has 4 references indexed in Scilit:
- Dynamic thermal expansion under transient laser-pulse heatingApplied Physics Letters, 1991
- Generation of Elastic Waves by Transient Surface HeatingJournal of Applied Physics, 1963
- Flash Method of Determining Thermal Diffusivity, Heat Capacity, and Thermal ConductivityJournal of Applied Physics, 1961
- Thermoelasticity and Irreversible ThermodynamicsJournal of Applied Physics, 1956