Submicron nickel filaments made by electroplating carbon filaments as a new filler material for electromagnetic interference shielding
- 1 February 1995
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 24 (2) , 107-113
- https://doi.org/10.1007/bf02659630
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- EMI application of highly conductive plastic composite using vapor-grown carbon fibers (VGCF)Published by SPIE-Intl Soc Optical Eng ,1993
- The effect of thermal stresses on the EMI (electromagnetic interference) shielding of conductive plasticsPolymer Composites, 1986
- The effect of compounding on the conductive properties of EMI shielding compoundsAdvances in Polymer Technology, 1984