Remote plasma chemical vapor deposition of copper for applications in microelectronics
- 1 July 1992
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
- Vol. 10 (4) , 1337-1340
- https://doi.org/10.1116/1.585865
Abstract
No abstract availableThis publication has 0 references indexed in Scilit: