Reduction of electromigration in gold thin films in the presence of hydrogen
- 1 November 1985
- journal article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 47 (9) , 1010-1011
- https://doi.org/10.1063/1.95972
Abstract
Electromigration lifetime experiments have been completed on Au thin-film interconnects (Au, 0.5 μm thick and 25 μm wide) in vacuum (5×10−8 Torr) and in both hydrogen (H2) and helium (He) ambients (10 Torr). Results show that electromigration is drastically suppressed in the H2 environment with a greater than tenfold increase in lifetime realized.Keywords
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