Fabrication of perfectly three-dimensional microstructures by UV depth lithography

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Abstract
Repeated conventional UV depth lithography and electroplating allows us to produce microstructures of varying size in the third dimension. The structures are about 50 micrometers high and the bearing clearances are in the micrometers range. A number of alternative processes and applications are reviewed. The status of the UV depth lithography of positive photoresist and the TUB process for electroplating (Au) high depth-to-width aspect ratio microstructures is briefly described. Capacitive micromotors, a capacitive acceleration sensor, and 3D microcoils have been fabricated. These results are discussed and possible future steps and applications are mentioned.

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