Holographic optical backplane for boards interconnection

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Abstract
Technological limitations appear in usual electrical interconnects (connector and electrical backplane) in new systems at the rack level. Optical solutions based on Holographic Optical Elements (HOE) on glass mastercard taking into account frequency and connectivity density limitations will be explained hereby. Also described is the realization solving both the tolerance problems (by an appropriate architecture) and the reliability of HOE (digital holograms). Original applications will be developed for reconfigurable interconnects between subassemblies of processors.

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