PCB glass-fibre laminates: Thermal conductivity measurements and their effect on simulation
- 1 December 1990
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 19 (12) , 1345-1350
- https://doi.org/10.1007/bf02662823
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Thermal modelling using ASTEC3 softwareInternational Journal of Numerical Modelling: Electronic Networks, Devices and Fields, 1988