Mechanical and Thermal Fatigue Property of Sn Base Solder Alloys.

• 1 January 2000
• journal article
• Published by Japan Institute of Electronics Packaging in Journal of The Japan Institute of Electronics Packaging
• Vol. 3  (7) , 592-599
• https://doi.org/10.5104/jiep.3.592

Abstract

Keywords

• SOLDER ALLOYS
• FATIGUE PROPERTY
• THERMAL FATIGUE
• SN BASE SOLDER