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Viscoelastic Analysis of IC Package Warpage
Home
Publications
Viscoelastic Analysis of IC Package Warpage
Viscoelastic Analysis of IC Package Warpage
TY
T. S. Yeung
T. S. Yeung
MY
M. M. F. Yuen
M. M. F. Yuen
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17 November 1996
proceedings article
Published by
ASME International
https://doi.org/10.1115/imece1996-0896
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