Using porous silicon as a sacrificial layer
- 1 March 1993
- journal article
- Published by IOP Publishing in Journal of Micromechanics and Microengineering
- Vol. 3 (1) , 32-36
- https://doi.org/10.1088/0960-1317/3/1/007
Abstract
A thick sacrificial layer for applications in bulk and surface micromachining can be achieved with porous silicon. The technology of freestanding parts of polysilicon is described. The etching process and the use of different masking layers are investigated.Keywords
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