Passivation of Cu by Sputter‐Deposited Ta and Reactively Sputter‐Deposited Ta‐Nitride Layers
- 1 September 1998
- journal article
- Published by The Electrochemical Society in Journal of the Electrochemical Society
- Vol. 145 (9) , 3170-3177
- https://doi.org/10.1149/1.1838782
Abstract
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