Pressure contact assembly technology of high power devices

This publication has 7 references indexed in Scilit:

• Design optimization for improving high power GTO switching characteristics with 'alloy free technology'
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2005
• A new low temperature diffusion bonding technology between large-area, high-power devices and internal Mo electrodes using Au-Al films
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
• Reliability of thick Al wire bonds in IGBT modules for traction motor drives
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
• 8 kV/3.6 kA light triggered thyristor
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
• A new high power low loss GTO
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
• Reliable 1200 amp 2500 V IGBT modules for traction applications
  Published by Institution of Engineering and Technology (IET) ,1995
• Novel large area joining technique for improved power device performance
  IEEE Transactions on Industry Applications, 1991