Influence of Some Geometric Factors on Contact Resistance Probe Measurements
- 1 March 1980
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 3 (1) , 159-165
- https://doi.org/10.1109/tchmt.1980.1135578
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Oxidation Kinetics of Copper from Gold Alloy Solution at 50°–150°CJournal of the Electrochemical Society, 1979
- Oxidation of Nickel and Nickel‐Gold Alloys in Air at 50°–150°CJournal of the Electrochemical Society, 1979
- Oxidation of copper in controlled clean air and standard laboratory air at 50°C to 150°CApplications of Surface Science, 1979
- Tarnishing Studies on Contact MaterialsIEEE Transactions on Parts, Materials and Packaging, 1967
- The relation between contact load and resistance, particularly at moderate and high loadPublished by Springer Nature ,1967
- The Contact Resistance and Mechanical Properties of Surface Films on MetalsProceedings of the Physical Society. Section B, 1955