Diffusion of copper through dielectric films under bias temperature stress
- 1 June 1995
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 262 (1-2) , 168-176
- https://doi.org/10.1016/0040-6090(95)05839-7
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
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