A High Density Thick Film Multilayer Process for LSI Circuits

• 1 September 1974
• journal article
• Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging
• Vol. 10  (3) , 165-168
• https://doi.org/10.1109/tphp.1974.1134855

Abstract

Keywords

• DIELECTRIC MATERIALS
• FABRICATION
• COPPER
• ETCHING
• GOLD
• NICKEL