Three-dimensional measurement by tilting and moving objective lens in CD-SEM

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Abstract
There is an increasing necessity for 3D measurement of formed patterns in the semiconductor manufacturing process, and the development of the 3D measurement technology is required even in CD-SEM. In order to obtain 3D images, it is necessary to acquire at least two tilted images from different directions. However, the procedure of tilting the specimen stage is disadvantageous from the throughput point of view. Therefore, we devised the T-MOL system, which enables the acquisition of tilt images without the deterioration of the resolution by tilting the primary electron beam. Moreover, the algorithm of the parallel projection for the 3D reconstruction was developed. Tests proved that new T-MOL electron optical system provides 4nm resolution tilting angle at 5 degrees and that 3D analysis based on T-MOL images is effective.

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