Reactive ion etching of Ta–Si–N diffusion barriers in CF4+O2

• 1 July 1994
• journal article
• Published by American Vacuum Society in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
• Vol. 12  (4) , 2352-2355
• https://doi.org/10.1116/1.587763

Abstract

Keywords

• REACTIVE ION ETCHING
• DIFFUSION BARRIERS
• CF4