A Study of the Mechanisms of Cermet Electrodeposition

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Abstract
The paper describes work on the mechanism by which solid ceramic particles are transferred from suspension in a plating electrolyte and occluded in a cathodic metal electrodeposit. Investigation was mainly on the system silicon carbide/copper, the copper bath being acid sulphate. The changes of the electrokinetic (zeta) potential with electrolyte concentration and composition were studied by a streaming potential method: it was found that the change of zeta potential with electrolyte concentration was an ionic strength effect, and was not specific-ion dependent. Deposition experiments were carried out to show the distribution of ceramic in the metal matrix: this was found to be related to the surface roughness, being highest where the surface was most rough and irregular. The mechanism of transport is seen to be a combination of hydrodynamic transport of particle to the cathode surface (followed possibly by electrophoretic transport through the double layer) and subsequent attachment and mechanical entrapment of the particle which is then keyed into place by electrodeposited metal.

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