Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part II: Modeling
- 1 August 1994
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 23 (8) , 729-734
- https://doi.org/10.1007/bf02651366
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- XCHEM-1D: A Heat Transfer/Chemical Kinetics Computer Program for multilayered reactive materialsPublished by Office of Scientific and Technical Information (OSTI) ,1993