Suppression of thermal conversion in Cr-doped semi-insulating GaAs

Abstract
Thermal conversion in the vicinity of the surface of a Cr‐doped semi‐insulating GaAs wafer to n‐type conductivity was effectively suppressed by annealing the wafer under arsenic vapor pressure. For the ion implantation of Si into qualified wafers, the arsine‐controlled capless‐anneal method provided a uniform and reproducible carrier concentration profile which was in good agreement with that predicted by the LSS theory. The doping efficiency of 100% was attained without anomaly due to thermal conversion.

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