Stencil printing of solder paste for fine-pitch surface mount assembly
- 1 January 1991
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 14 (3) , 560-566
- https://doi.org/10.1109/33.83944
Abstract
No abstract availableThis publication has 1 reference indexed in Scilit:
- Solder Paste in Electronics PackagingPublished by Springer Nature ,1989