Oxidative decomposition of polymethylmethacrylate (PMMA) in plasma etching

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Abstract
Investigations on the plasma chemical oxidation process of polymethylmethacrylate have been performed in a parallel-plate RF discharge. Oxygen radicals are shown to be the chemical species that is essential for oxidative etching. Ion bombardment of the polymer surface is characterized as the energetically dominant activation mechanism. Based on a macroscopic point of view taking only the stable reactants into account and an exact quantitative balance of all initial substances and reaction products, it is demonstrated that elementary rules of chemistry, such as stoichiometric substance conversion and a modified mass action law, are also valid in plasma chemical processes. By means of these fundamental laws, the composition of stable gases in the reactor and the effectiveness of the process are explained.