Thermopower and Resistivity Studies of theAuVandAuCuVSystems

The low-temperature transport properties of dilute $\mathrm{Au}\mathrm{V}$ and $\mathrm{AuCu}\mathrm{V}$ alloys have been investigated by measuring their thermoelectric powers from 10 to 300 K and their electrical resistivities from 1.5 to 300 K. The alloys consisted of 0.4, 0.7, and 1.0 at.% vanadium dissolved in a ${\mathrm{Au}}_{1-x}{\mathrm{Cu}}_x$ host where $x=0, 10, \mathrm{and} 20$ at.%. It is shown that at low temperatures ($\mathrm{Au}\mathrm{V}$ system can be described by a $T^2$ law. The implied Kondo temperature (280 K), however, is higher than that obtained by other means. In particular, the thermopower data suggest a Kondo temperature of 160 K for the $\mathrm{Au}\mathrm{V}$ system. For temperatures exceeding 25 K the impurity resistivity decreases linearly with increasing temperature. Reduced Nordheim-Görter plots, prepared for estimating the characteristic thermopower of vanadium in Au and AuCu hosts, produce higher values than the experimental ones. Possible reasons are put forward.