Multichip module technologies for high-speed ATM switching systems
- 25 August 2005
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
High-performance, compact multichip modules (MCMs) using a copper polyimide multi-layer substrate are used to make a 40-Gb/s-throughput ATM switching module. The MCM substrate has 392 high-speed signal I/0 channels, thin-film termination resistors, and 50 /spl mu/m laminated capacitance layers. We made a sub switching element module using these MCMs, new high-speed FPC cables, and heat pipes fins. This sub-switching element module can operate at 80 Gb/s throughput.Keywords
This publication has 8 references indexed in Scilit:
- Heat-Pipe Cooling Technology for High-Speed Atm Switching McmsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2005
- ATM switch hardware technologies using multichip packagingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Coaxial SMT module connector for high-speed MCMPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Over 20 Gbit/s throughput ATM crosspoint switchlarge scale integrated circuit using Si bipolar technologyElectronics Letters, 1994
- Evolving from narrowband (ISDN)IEEE Communications Magazine, 1992
- High-speed signal propagation on lossy transmission linesIBM Journal of Research and Development, 1990
- Gigabit logic bipolar technology: advanced super self-aligned process technologyElectronics Letters, 1983
- Losses in MicrostripIEEE Transactions on Microwave Theory and Techniques, 1968