The effect of annealing on residual stress and dislocation propagation in silicon slices with damaged layer induced by scribing
- 1 March 1981
- journal article
- Published by Springer Nature in Journal of Materials Science
- Vol. 16 (3) , 767-774
- https://doi.org/10.1007/bf02402794
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
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- Quantitative Measurement of Stress in Silicon by Photoelasticity and Its ApplicationJournal of the Electrochemical Society, 1980
- On the scribing and subsequent fracturing of silicon semiconductor wafersJournal of Materials Science, 1979
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- Annealing of scratches on near (111) silicon slicesJournal of Physics D: Applied Physics, 1979
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- Velocities of Screw and 60°‐Dislocations in SiliconPhysica Status Solidi (b), 1972
- Generation of Scratch-Induced Dislocations in Silicon and Its Orientation DependenceJapanese Journal of Applied Physics, 1965