Cracking failures in lead-on-chip packages induced by chip backside contamination
- 1 January 1995
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 18 (1) , 119-126
- https://doi.org/10.1109/96.365498
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
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