High temperature dielectric study of epoxy resins

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Abstract
Four common 177°C‐curing organic resin formulations were studied dielectrically. Results and discussion are presented on the variation of resin electronic properties during cure. In particular, capacitance and dissipation curves are discussed as a function of time in the cure cycle. Variations in frequency are shown to affect the other electronic properties and a frequency “shift” in dissipation sensitivity is noted.
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