The Relationship Between Electromigration-Induced Short-Circuit and Open-Circuit Failure Times in Multi-Layer VLSI Technologies

Publisher Website

1 April 1984

proceedings article
Published by Institute of Electrical and Electronics Engineers (IEEE) in 8th Reliability Physics Symposium

p. 48-51
https://doi.org/10.1109/irps.1984.362018

Abstract

No abstract available

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