Copper metallization for advanced IC: requirements and technological solutions

• 31 January 2000
• journal article
• Published by Elsevier in Microelectronic Engineering
• Vol. 50  (1) , 391-401
• https://doi.org/10.1016/s0167-9317(99)00307-x

Abstract

Keywords

• COPPER
• DAMASCENE
• CMP
• ELECTROMIGRATION