Slow crack growth of CVD diamond
- 1 April 1992
- journal article
- Published by Springer Nature in Journal of Materials Research
- Vol. 7 (4) , 781-783
- https://doi.org/10.1557/jmr.1992.0781
Abstract
Slow crack growth in CVD diamond has been observed from indentation experiments. Diamond films of 400 μm thickness were prepared by plasma-enhanced CVD on a silicon substrate, subsequently removed from the substrate, and polished for indentation testing. A microhardness tester was used to produce Vickers indentations under low load. Crack length measurements over time revealed susceptibility to slow crack growth in ambient testing conditions. The stress-corrosion susceptibility coefficient, N, was measured as 9.3.Keywords
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