TEM Observation of the Al and Cu Interfaces Bonded at Room Temperature by Means of the Surface Activation Method
Open Access
- 1 January 1990
- journal article
- Published by Japan Institute of Metals in Journal of the Japan Institute of Metals and Materials
- Vol. 54 (6) , 713-719
- https://doi.org/10.2320/jinstmet1952.54.6_713
Abstract
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