Formation and resettlement of (AuxNi1−x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish
- 1 October 2000
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 29 (10) , 1175-1181
- https://doi.org/10.1007/s11664-000-0010-y
Abstract
No abstract availableKeywords
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- Fast Diffusion in MetalsPublished by Elsevier ,1975