Time-independent elastic–plastic behaviour of solder materials
- 1 December 2004
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 44 (12) , 1893-1900
- https://doi.org/10.1016/j.microrel.2004.04.015
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Evaluation of board level reliability of Pb-free PBGA solder jointsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Development of BGA solder joint vibration fatigue life prediction modelPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Creep and crack propagation in flip chip SnPb37 solder jointsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Are we over designing for solder joint reliability? Field vs. accelerated conditions, realistic vs. specified requirementsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Constitutive behaviour of lead-free solders vs. lead-containing solders-experiments on bulk specimens and flip-chip jointsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2001
- Capillary soldering system for the material property characterization of solder jointsReview of Scientific Instruments, 1993