Effect of Hot‐Pressing Temperature on the Thermal Diffusivity/Conductivity of SiC/AlN Composites
- 1 March 1983
- journal article
- Published by Wiley in Journal of the American Ceramic Society
- Vol. 66 (3) , C‐40-C‐41
- https://doi.org/10.1111/j.1151-2916.1983.tb10029.x
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Effet of Nikel Alloying on the Thermal Diffusivity/ondutivity of MgO Single rystalsJournal of the American Ceramic Society, 1982
- Composition and Properties of Hot‐Pressed SiC‐AIN Solid SolutionsJournal of the American Ceramic Society, 1982
- Fabrication and characterization of SiC-AIN alloysJournal of Materials Science, 1981
- Flash Method of Determining Thermal Diffusivity, Heat Capacity, and Thermal ConductivityJournal of Applied Physics, 1961
- Effect of Point Imperfections on Lattice Thermal ConductivityPhysical Review B, 1960