Assessment of board level solder joint reliability for PBGA assemblies with lead‐free solders
- 1 December 2002
- journal article
- Published by Emerald Publishing in Soldering & Surface Mount Technology
- Vol. 14 (3) , 46-50
- https://doi.org/10.1108/09540910210444728
Abstract
Evaluates the board level reliability of plastic ball grid array (PBGA) assemblies under thermal and mechanical loading, with the objective of characterizing the reliability of lead‐free solder joints for various assembly conditions. A five‐leg experiment was designed which included various combinations of solder materials and peak reflow temperatures. It was found that the lead‐free solder joints have a much longer thermal fatigue life than the 63Sn–37Pb solder. The 63Sn–37Pb solder joints seem to perform slightly better than the lead‐free solder under mechanical loading.Keywords
This publication has 4 references indexed in Scilit:
- Design for Plastic Ball Grid Array Solder Joint ReliabilityCircuit World, 1997
- Effect of Chip Dimension and Substrate Thickness on the Solder Joint Reliability of Plastic Ball Grid Array PackagesCircuit World, 1997
- An Experimental and Finite Element Study of Thermal Fatigue Fracture of PbSn Solder JointsJournal of Electronic Packaging, 1993
- Solder Joint ReliabilityPublished by Springer Nature ,1991