Abstract
A high molecular weight polyamide–imide polymer derived from the reaction of TMAC–DAPE has been prepared and its film properties have been evaluated. Poly‐[N,N′‐(4,4′‐diphenyl ether) 4‐amidophthalimide] film has an excellent combination of mechanical, electrical, and chemical properties at room temperature and at 200°C. A comparison of the film properties of this material with those of a commercial polyimide film, Teflon, FEP, Nomex paper, and Mylar films is also presented.

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