Abstract
This paper describes thin‐film stress, stoichiometric ratio, deposition rate, and refractive index of an rf‐sputtered titanium‐oxide dielectric film. High compressive stresses (1010 dyn/cm2) were obtained, which can be correlated to the argon sputtering gas incorporation and peening effect. The process dependencies of the stoichiometric ratio, deposition rate, and refractive index are also described.