Compound Formation at Cu-In Thin-Film Interfaces Detected by PerturbedAngular Correlations
- 27 May 1985
- journal article
- research article
- Published by American Physical Society (APS) in Physical Review Letters
- Vol. 54 (21) , 2371-2374
- https://doi.org/10.1103/physrevlett.54.2371
Abstract
Interface compound formation at Cu-In films is studied with the perturbed angular correlation method using radioactive probe atoms. The growth of a Cu intermetallic interface phase is observed with a sensitivity on the scale of atomic distances in the temperature range between 220 and 340 K. This new phase is characterized by an electric field gradient (at K) with V/ and . The activation energy of phase formation for Cu was determined to be 0.42(2) eV.
Keywords
This publication has 5 references indexed in Scilit:
- Compounds and pseudo-binary alloys with the CuAl2(C16)-type structure I. Preparation and X-ray resultsPublished by Elsevier ,2003
- Electric field gradients in metalsHyperfine Interactions, 1983
- Sensitive Probing of Surfaces by Electric Quadrupole Interaction Demonstrated for Indium MetalPhysical Review Letters, 1982
- Impurity diffusion of114In in CuCrystal Research and Technology, 1978
- Constitution of Binary AlloysJournal of the Electrochemical Society, 1958