The resistance minimum in dilute alloys of tin in copper
- 1 May 1959
- journal article
- research article
- Published by Taylor & Francis in Philosophical Magazine
- Vol. 4 (41) , 612-621
- https://doi.org/10.1080/14786435908238257
Abstract
Previous experimental work on the resistance minimum caused by tin in dilute solid solution in polycrystalline copper led to the expectation that there might be no minimum in similar alloys which were single crystals. We find that this is the case and that the minimum can be produced by making the monocrystalline alloys polycrystalline. It is suggested that the resistance minimum occurs as a result of segregation of the tin atom on the grain boundaries of the polycrystalline alloys. For dilute alloys of iron in copper there was, as expected, practically no difference in the resistance minimum observed in polycrystalline and in monocrystalline alloys.Keywords
This publication has 12 references indexed in Scilit:
- THE ELECTRICAL RESISTANCE OF SOME METALS AND ALLOYS BELOW 1° K.Canadian Journal of Physics, 1957
- Resistivity Increase in Water-Quenched GoldPhysical Review B, 1956
- CIV. Electron transport in copper arid dilute alloys at low temperatureJournal of Computers in Education, 1955
- A superconducting modulatorJournal of Scientific Instruments, 1955
- Electron transport in copper and dilute alloys at low temperatures. IIActa Metallurgica, 1955
- Electron transport in copper and dilute alloys at low temperatures. IActa Metallurgica, 1955
- THE ELECTRICAL RESISTANCE OF DILUTE COPPER ALLOYS AT VERY LOW TEMPERATURESCanadian Journal of Physics, 1955
- Interaction of Electrons with Grain BoundariesPhysical Review B, 1954
- Structural Defects in Copper and the Electrical Resistivity MinimumPhysical Review B, 1954
- The electrical resistances of alloys of a noble metal and a transition metalPhysica, 1952