The mechanical properties and microstructures of copper and brass joints soldered with eutectic tin-bismuth solder
- 1 May 1987
- journal article
- research article
- Published by Springer Nature in Journal of Materials Science
- Vol. 22 (5) , 1835-1839
- https://doi.org/10.1007/bf01132413
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
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- The strength of brass/Sn-Pb-Sb solder joints containing 0 to 10% SbJournal of Materials Science, 1986
- Effect of compositional changes and impurities on wetting properties of eutectic Sn–Bi alloy used as solderMaterials Science and Technology, 1985
- Stress relaxation in Tin-Lead soldersMaterials Science and Engineering, 1979
- Creep behaviour in the superplastic Pb–62% Sn eutecticPhilosophical Magazine, 1975
- Hardness and creep of Bi-Sb alloys under spherical indentationMetallurgical Transactions, 1973