Low cost options for next generation packaging

Publisher Website

11 November 2002

proceedings article
Published by Institute of Electrical and Electronics Engineers (IEEE)

p. 457-459
https://doi.org/10.1109/eptc.2000.906416

Abstract

No abstract available

Keywords

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International microsystems, packaging, assembly and circuits technology conference (IMPACT 2011): P1. Emerging systems packaging technologies
Published by Institute of Electrical and Electronics Engineers (IEEE) ,2011