Temperature and flow effects in aluminum etching using bromine-containing plasmas
- 1 January 1988
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science & Technology B
- Vol. 6 (1) , 72-76
- https://doi.org/10.1116/1.584055
Abstract
The effects of sample temperature and reactant flow rate on aluminumetching in BBr3 and BBr3/Br2 mixtures were investigated in a parallel‐plate plasmaetcher.Etch samples were bonded to the electrode with conductive epoxy to promote thermal equilibrium. Results indicated that the reaction was gas phase controlled between 30 and 140 °C; above 140 °C, the gas phase limitation may be due to reactant adsorption while a product desorption limitation may exist below 30 °C. Transport limitations were encountered at reactant flow rates below 10 sccm.Keywords
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