Development goals and present status of 3M's adhesive interconnection technology

• 1 December 1993
• journal article
• Published by World Scientific Pub Co Pte Ltd in Journal of Electronics Manufacturing
• Vol. 3  (4) , 191-197
• https://doi.org/10.1142/s0960313193000206

Abstract

Keywords

• ADHESIVE INTERCONNECTION
• FLAT-PANEL DISPLAY
• TAB
• FLIP-CHIP