Fatigue Behavior of Solders Used in Flip-Chip Technology

Publisher Website

1 March 1973

journal article
Published by ASTM International in Journal of Testing and Evaluation

Vol. 1 (2) , 170-178
https://doi.org/10.1520/jte10895j

Abstract

No abstract available

Keywords

This publication has 5 references indexed in Scilit:

Reliability of Controlled Collapse Interconnections
IBM Journal of Research and Development, 1969
Fatigue crack formation in bicrystals of lead
Philosophical Magazine, 1966
Fatigue: A complex subject—Some simple approximations
Experimental Mechanics, 1965
The effect of cycle frequency and atmospheric corrosion on the fatigue of lead
Philosophical Magazine, 1964
A New Experience
The American Journal of Nursing, 1951