Stress free assembly technique for a silicon based pressure sensor
- 1 January 1991
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Fabrication of Non‐Underetched Convex Corners in Anisotropic Etching of (100)‐Silicon in Aqueous KOH with Respect to Novel Micromechanic ElementsJournal of the Electrochemical Society, 1990
- Novel Stress Free Assembly Technique for Micromechanical DevicesPublished by Springer Nature ,1990
- Fabrication of catheter-tip and sidewall miniature pressure sensorsIEEE Transactions on Electron Devices, 1982