Abstract
A new polishing technique for the aluminum (Al) metallization is developed, referred to as an Abrasive-Free, Chemical-Mechanical-Polishing (AFP) technique, in which aqueous amine and hydrogen-peroxide (H/sub 2/O/sub 2/) solution is used as a polishing liquid. Scratch-free Al plugs embedded in SiO/sub 2/ films are obtained by the AFP with the high polishing selectivity of the Al to SiO/sub 2/.

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