Interdiffusion mechanisms in Ag-Au thin-film couples
- 15 December 1976
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 29 (12) , 772-775
- https://doi.org/10.1063/1.88944
Abstract
The roles of grain‐boundary and bulk diffusion in thin‐film couples of Ag‐Au have been elucidated by comparing interdiffusion profiles in single‐crystal and polycrystalline couples. The use of self‐supporting couples, and Rutherford backscattering for depth analysis, greatly simplify interpretation of the data. Room‐temperature grain‐boundary diffusion is observed in polycrystalline couples with a diffusion coefficient ∼−1014 cm2 sec−1. On annealing these polycrystalline films, at temperatures ⩽400 °C, an initial fast interdiffusion is observed followed by a slower process; models for this behavior are presented.Keywords
This publication has 5 references indexed in Scilit:
- Diffusion mechanisms in the Pd/Au thin film system and the correlation of resistivity changes with Auger electron spectroscopy and Rutherford backscattering profilesThin Solid Films, 1976
- Depth profiles of Au overlayers on Ag filmsJournal of Vacuum Science and Technology, 1976
- Thin-film interdiffusion. I. Au-Pd, Pd-Au, Ti-Pd, Ti-Au, Ti-Pd-Au, and Ti-Au-PdJournal of Applied Physics, 1975
- The diffusion of gold through polycrystalline silver in thin films at temperatures near 150°CThin Solid Films, 1975
- Effect of Gradient Energy on Diffusion in Gold-Silver AlloysJournal of Applied Physics, 1969