Organometallic materials in lithography: A review

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Abstract
Organosilicon polymers have found many uses in the electronics industry in the last 25 years due to their low‐dielectric constant and water‐repelling properties. These uses include insulators and encapsulating materials (RTV) for electronic parts. More recently, siloxanes have been incorporated into polyimides for the purpose of increasing the water resistance, improving mechanical properties, and preventing atomic oxygen attack of polyimides [R. H. Bott, J. D. Summers, C. A. Arnold, L. T. Taylor, T. C. Ward, and J. E. McGrath, J. Adhes. 2 3, 67 (1987)]. In only the last few years, some uses of organosilicon polymers in lithography have been reported. In this paper, a review of these uses will be presented and the requirements for organosilicon materials in lithographic applications will be outlined.

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