Surfactant-Assisted Metallorganic CVD of (111)-Oriented Copper Films with Excellent Surface Smoothness

1 January 1999

journal article
Published by The Electrochemical Society in Electrochemical and Solid-State Letters

Vol. 3 (3) , 138-140
https://doi.org/10.1149/1.1390981

Abstract

In chemical vapor deposition (CVD) of copper, adsorption of iodine on the growing film surface greatly suppresses the development of surface roughness such that thick films show a root‐mean‐square roughness and a high specular reflectance of 85% for a laser beam. The films are predominantly (111)‐oriented regardless of the deposition conditions, whereas without iodine adsorption, the film texture depends on the substrate temperature. The results are attributed to the surfactant effects of the adsorbed iodine atoms to promote lateral growth. ©2000 The Electrochemical Society

Keywords

COPPER

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