Conductive adhesives for SMT and potential applications

• 1 May 1995
• journal article
• Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
• Vol. 18  (2) , 284-291
• https://doi.org/10.1109/96.386263

Abstract

Keywords

• OCCUPATIONAL HEALTH
• SMT
• CONDUCTIVE ADHESIVES
• REWORK
• MICROSTRUCTURE
• EPOXY
• ADHESIVE TYPES
• MEASUREMENTS OF RESISTANCE
• MANUFACTURING